Media OutReach
“AI in Action” Career Day Inaugural AI-Focused Recruitment Drive 1,000+ Tech Roles to Attract Top Talent and Address Industry Demands
Agile Response to Market Needs and Attracting Top AI Talent
The “AI in Action” Career Day was held in a hybrid format (physical and virtual), uniting leading AI enterprises across both platforms. Participants engaged directly with hiring representatives at the venue or explored job vacancies, requirements, and submitted applications via the online “Talent Pool” platform. The event also featured skill-building workshops on jobsearch techniques and personal brand-building, alongside industry insight sessions where participants interacted with experts from global leaders such as NVIDIA, Deloitte AI Institute, and Madhead. These engagements offered deep insights into AI advancements, career pathways, and emerging industry trends.
Mr Albert Wong, CEO of HKSTP, said: “We are delighted by the overwhelming turnout, which underscores the industry’s strong demand for AI talent. In this era of rapid technological evolution, HKSTP is committed to bridging the gap between technological innovation and top talent. Going forward, we will continue to adapt proactively to market dynamics, leveraging thematic recruitment initiatives to address specific talent needs. We look forward to working hand-in-hand with the next generation of innovators and academic institutions to establish Hong Kong as a key global hub for technological innovation.”
Launching the ‘Talent Foundry’ Initiative to Strengthen Collaboration Among Talent, Universities, and Industry
To unlock the potential of Hong Kong’s students and strengthen the local talent pipeline, HKSTP, in collaboration with engineering and computer science faculties from universities in Hong Kong, launched the “Talent Foundry” initiative to bridge the gap between student skills and job market needs, fostering closer ties between academia and the I&T industry.
The official launch brought together deans and associate deans from the Chinese University of Hong Kong, City University of Hong Kong, Hong Kong Baptist University, Hong Kong Polytechnic University, Hong Kong University of Science and Technology, and the University of Hong Kong. Their participation highlights the strong university-industry collaboration fostered by the Talent Foundry initiative.
Talent Foundry connects students and graduates with enterprises and startups in the Science Park ecosystem, creating career pathways and providing professional development to immerse young talent in the vibrant I&T community.
Through this initiative, HKSTP is committed to nurturing talent and driving Hong Kong’s growth as a global innovation hub.
HKSTP Recruits Global Tech Talent and Showcases Hong Kong’s I&T Opportunities Worldwide
Building on the success of the first ‘AI In Action’ Career Day in 2025, plans are underway to explore additional themed recruitment initiatives such as microelectronics, life and health tech, and financial technology aimed at fostering connections between talent and opportunity in innovative ways.
To further expand Hong Kong’s I&T talent base and solidify its position as a global hub for top-tier professionals, an HKSTP delegation will embark on a talent recruitment mission to the United Kingdom in March. The delegation will engage with prestigious universities and research institutions to explore collaborative talent development frameworks, while also connecting directly with students through campus engagements. These interactions will showcase Hong Kong’s dynamic I&T ecosystem, highlighting diverse internships and high-growth career pathways within the city’s thriving innovation landscape.
Hashtag: #HKSTP #AIinAction
The issuer is solely responsible for the content of this announcement.
About Hong Kong Science and Technology Parks Corporation
Hong Kong Science and Technology Parks Corporation (HKSTP) was established in 2001 to create a thriving I&T ecosystem grooming 13 unicorns, more than 15,000 research professionals and over 2,200 technology companies from 26 countries and regions focused on developing healthtech, AI and robotics, fintech and smart city technologies, etc.
Our growing innovation ecosystem offers comprehensive support to attract and nurture talent, accelerate and commercialise innovation for technology ventures, with the I&T journey built around our key locations of Hong Kong Science Park in Pak Shek Kok, InnoCentre in Kowloon Tong and three modern InnoParks in Tai Po, Tseung Kwan O and Yuen Long realising a vision of new industrialisation for Hong Kong, where sectors including advanced manufacturing, micro-electronics and biotechnology are being reimagined.
Hong Kong Science Park Shenzhen Branch in Futian, Shenzhen plays positive roles in connecting the world and the mainland with our proximity, strengthening cross-border exchange to bring advantages in attracting global talent and allowing possibilities for the development of technology companies in seven key areas: Medtech, big data and AI, robotics, new materials, microelectronics, fintech and sustainability, with both dry and wet laboratories, co-working space, conference and exhibition facilities, and more.
Through our R&D infrastructure, startup support and enterprise services, commercialisation and investment expertise, partnership networks and talent traction, HKSTP continues contribute in establishing I&T as a pillar of growth for Hong Kong.
More information about HKSTP is available at 
www.hkstp.org.
Available in Six Expressive Colorways, HYTE’s Latest PC Case Delivers Perfect Balance of Form and Function with Accessible Pricing
CALIFORNIA, UNITED STATES – Media OutReach Newswire – 19 December 2025 – HYTE, a leading manufacturer of cutting-edge PC components and peripherals, announces its highly anticipated X50 and X50 Air Modern Performance Cases are now available. Following its successful Computex 2025 debut, the X50 cases are meticulously designed chassis engineered with premium materials and finishes for incredible durability, while maintaining a builder-friendly experience with tool-less panels, integrated cable management, and future-proof component compatibility.
HYTE’s new X50 and X50 Air cases redefine traditional PC chassis design with fully rounded construction and built-in performance optimizations. These include a Full-Coverage Micro-Mesh front panel for low-pressure air intake, HYTE’s patent-pending Louvered Blade Ventilation on the back which reduces exhaust impedance while reinforcing rigidity, and a structural top-mounted PSU canopy enabling hassle-free cable management. Both cases feature massive 360mm radiator support on front and side, with total capacity for up-to-10 fans, including up to 3x 120mm extra-thick fans on the bottom for cold-floor GPU cooling.
Key features include:
- Premium Build Materials – 1mm-thick steel improves chassis strength and durability. Manufactured with Automotive-Grade Tooling, the X50 has 4x tighter tolerances than other PC cases, achieving its signature rounded curves
- Superior Build Experiences – The rounded design contributes to a comfortable build experience. Its tool-less front and side panels, covertly routed cable-routing channels, and spacious interiors lets anyone build in the X50 with no obstructions.
- Distinct Aesthetic Options – X50 features sweeping curved 4mm-thick laminated acoustic glass for maximum visibility and noise dampening. X50 Air uses curved Full-Coverage Micro-Mesh panel for enhanced airflow. X50 Air available in Snow White and Pitch Black; standard X50 in Snow White, Pitch Black, Wild Cherry, Taro Milk, Strawberry Milk, and Matcha Milk
WEBSITE: https://hyte.com/store/x50
Hashtag: #HYTE
The issuer is solely responsible for the content of this announcement.
ABOUT HYTE
HYTE is a lifestyle-centered brand enhancing play with innovative PC components and accessories. Designed for gaming, music, arts and entertainment, all HYTE products are rigorously researched and tested. Visit: 
http://www.hyte.com
Available in Six Expressive Colorways, HYTE’s Latest PC Case Delivers a Perfect Balance of Form and Function Through its Disciplined Multi-Dimensional Design Complete with Accessible Pricing
CALIFORNIA, UNITED STATES – Media OutReach Newswire – 19 December 2025 – HYTE, a leading manufacturer of cutting-edge PC components and peripherals, is excited to announce that its highly anticipated X50 and X50 Air Modern Performance Cases are now available. Following its successful Computex 2025 debut, the X50 cases are meticulously designed PC chassis that are engineered with premium materials and finishes that allow for incredible durability, while maintaining a builder-friendly experience with its tool-less panels, integrated cable management solutions, and future-proof component compatibility.
HYTE’s new X50 and X50 Air cases redefine traditional PC chassis design, as both cases feature a fully rounded design with several built-in performance optimizations. These include a Full-Coverage Micro-Mesh front panel for low-pressure and low-resistance air intake, HYTE’s patent-pending Louvered Blade Ventilation on the back of the case which reduces exhaust impedance while reinforcing case rigidity, and a structural top-mounted PSU canopy that lets the PSU act as an exhaust fan while opening up hassle-free cable management. Both the X50 and X50 Air feature massive 360mm radiator support on the front and side of the case, with a total capacity of up-to-10 fans, including up to 3x 120mm extra-thick fans on the case’s bottom for cold-floor cooling that keeps any GPU comfortably cool.
Other key features of the X50 and X50 Air Modern Performance Cases include:
- Premium Build Materials – Both cases use 1mm-thick steel that improves chassis strength and durability. Manufactured with Automotive-Grade Tooling, the X50 has 4x tighter tolerances than other PC cases, which allows HYTE to achieve the X50’s rounded compounded curves
- Superior Build Experiences – The X50 and X50 Air’s rounded design contributes to the ease of any build without being harsh on a builder’s hands. Its tool-less front and side panels, covertly routed cable-routing channels, and spacious interiors lets anyone build in the X50 with no obstructions.
- Distinct Aesthetic Options – The X50 comes with a sweeping curved 4mm-thick laminated acoustic glass for maximum visibility and passive noise dampening. The X50 Air swaps the glass panel with a curved Full-Coverage Micro-Mesh panel that enhances the case’s airflow capabilities. While the X50 Air only comes in Snow White and Pitch Black, the standard X50 will be available in Snow White, Pitch Black, Wild Cherry, Taro Milk, Strawberry Milk, and Matcha Milk colorways.
WEBSITE:
To know more about an X50 or an X50 Air Modern Performance Case, please visit: https://hyte.com/store/x50
Hashtag: #HYTE
The issuer is solely responsible for the content of this announcement.
ABOUT HYTE
HYTE is a lifestyle-centered brand focused on enhancing play with its fresh and innovative PC components and accessories. Designed to fuel passions in gaming, music, the arts and entertainment, all HYTE products are rigorously researched and tested before they are brought to fruition. HYTE, as a company and its products, are inspired by the needs and behaviors of its community and the many ways people play. HYTE is committed to designing products to help people experience play throughout their lifestyle, no matter what that may be. To learn more, please visit: 
http://www.hyte.com
Work-Integrated Learning Matters
Work-Integrated Learning bridges the gap between classroom theory and practical application. By immersing students in authentic work environments, internships cultivate essential skills beyond technical knowledge, including cognitive abilities such as problem-solving, affective traits like emotional intelligence, and psychomotor skills that enhance hands-on performance. Graduates who master these dimensions stand out as versatile professionals ready to contribute from day one, shaping leaders of the future who can drive innovation and growth.
The SIM60 WILL Award: Setting Graduates Apart
The SIM60 WILL Award is more than a recognition, it is a testament to resilience and excellence. Students who complete internships successfully and demonstrate perseverance in challenging situations are honoured for their commitment to growth. This award signals to employers that recipients are not only academically competent but also workplace-ready, equipped with the adaptability and grit that modern industries demand. It reinforces SIM’s mission to foster sustainable employment by preparing graduates for long-term career success.
Success Stories That Inspire
Recipients of the SIM60 WILL Award come from varied academic and personal backgrounds, yet many share a common pathway: leveraging work-integrated learning experiences to strengthen their career readiness. Several award recipients have used internships to apply classroom knowledge to real business environments, developing data dashboards, automating processes, supporting cybersecurity initiatives, and contributing to enterprise-level digital projects.
For some, these internships have served as stepping stones to contract or full-time roles in areas such as business analysis, project management and data operations. Others have progressed to subsequent placements in high growth sectors, where exposure to real world challenges has helped refine their technical skills and broaden their understanding of industry expectations.
These experiences reflect SIM’s commitment in shaping leaders of the future and fostering Sustainable Employment through Work-Integrated Learning, demonstrating how structured internships, supported by SIM’s guidance and reinforced through the WILL Award, equip learners with practical competencies and professional confidence to navigate evolving career landscapes.
Impact on Employability
Internship experience is a proven differentiator in hiring decisions. According to global employability studies, candidates with practical exposure are significantly more likely to secure roles and advance in their careers. The SIM60 WILL Award amplifies this advantage by validating the quality of a student’s internship performance. For employers, it serves as a trusted benchmark of talent. For graduates, it opens doors to opportunities that might otherwise remain out of reach, enhancing employability in a rapidly evolving economy.
Key Takeaways
The SIM60 WILL Award reflects SIM’s ongoing efforts to integrate work experience into education, supporting students in building practical skills that complement academic learning. By recognizing internship excellence, the award highlights the importance of resilience and adaptability in preparing graduates for the evolving job market.
References:
- SIM60 WILL Award/Career Service – https://www.sim.edu.sg/degrees-diplomas/life-at-sim/career-services
- Ng Jing Heng on Turning an Internship into a Career Launchpad – https://www.sim.edu.sg/articles-inspirations/ng-jing-heng-on-turning-an-internship-into-a-career-launchpad
- Chen Soon Keat’s Journey from Intern to Innovator – https://www.sim.edu.sg/articles-inspirations/chen-soon-keat-journey-from-intern-to-innovator
Hashtag: #SIMGlobalEducation #SIMGE #GlobalEducation #InternationalDegree #CareerReady #FutureSkills
The issuer is solely responsible for the content of this announcement.
About SIM Global Education
SIM Global Education (SIM GE) is a leading private education institution in Singapore and the region. We offer more than 140 academic programmes ranging from diplomas and graduate diploma programmes to bachelor’s and master’s degree programmes with some of the world’s most reputable universities from Australia, Canada, Europe, United Kingdom, and the United States. SIM GE’s cohort is made up of 16,000 full- and part-time students and adult learners, of which approximately 36% are international students hailing from over 50 countries.
SIM GE’s holistic learning approach and culturally diverse learning environment aim to equip students with knowledge, industry skills and employability competencies, as well as a global perspective to succeed as future leaders in a fast-changing, technologically driven world.
For more information on SIM Global Education, visit sim.edu.sg
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