Media OutReach
HKPC Launches Hong Kong’s First “Low-altitude Economy Tech Hall”
Building Hong Kong into the Asia-Pacific hub for low-altitude innovation applications, advancing the implementation of the low-altitude economy
HONG KONG SAR – Media OutReach Newswire – 30 September 2025 – The Hong Kong Productivity Council (HKPC) today held the grand opening ceremony of the “Low-altitude Economy Tech Hall,” with Mr WONG Wai-lun, Michael, GBS, JP, Deputy Financial Secretary of the HKSAR Government, serving as the Guest of Honor, together with Hon Sunny TAN, Chairman of HKPC; Hon Elizabeth Quat, SBS, JP, Legislative Council Member and Founding President of the Greater Bay Area Low Altitude Economy Alliance; as well as leaders from government, business, and academia, to witness a new milestone in Hong Kong’s journey toward airspace innovation and new-quality productive forces.
Smart city’s new engine: Low-Altitude Economy Shapes Hong Kong’s New Industrial Landscape
The low-altitude economy is a key component in building smart cities, integrating multiple innovative technologies including unmanned aircrafts, passenger electric vertical take-off and landing aircraft (eVTOL), airspace management, artificial intelligence (AI), and energy materials. Characterised by high growth, high integration, and high penetration, it is rapidly becoming a new industry contested worldwide. The Civil Aviation Administration of China projects the market size to reach RMB 1.5 trillion by 2025 and RMB 3.5 trillion by 2035.
Hong Kong has the distinctive advantages of enjoying strong support of the motherland and being closely connected to the world, along with multiple high-value scenarios for the low-altitude economy, including high-end logistics, emergency response, integration of culture and tourism, industrial applications, public utilities, and unmanned driving, demonstrating its potential for developing the low-altitude economy. The “Low-altitude Economy Tech Hall” launched by HKPC today marks the new starting point for the industrialisation of Hong Kong’s low-altitude economy, providing a one-stop platform for research commercialisation, technology validation, standard setting, and application deployment.
Mr WONG Wai-lun, Michael, GBS, JP, Deputy Financial Secretary of the HKSAR Government said, “The government is actively promoting the development of the low-altitude economy and seeks collaborative partners to engage and work alongside various sectors. In March of this year, the government announced the first batch of 38 Regulatory Sandbox pilot projects, of which 17 have already begun testing. By the end of October, a total of 28 projects are expected to be in testing. This reflects enthusiastic responses from all sectors and showcases the government’s swift progress in advancing the low-altitude economy, with a commitment to sustaining this momentum in the future.”
Hon Sunny TAN, Chairman of HKPC said, “Beyond being a showcase for innovative technologies, the ‘Low-altitude Economy Tech Hall’ is also a testbed for institutional innovation. Through this platform, we aim to bring together government, industry, academia, and research to jointly explore airspace management models and application scenarios in high-density urban environments, creating a ‘Hong Kong model’ for the low-altitude economy and further consolidating our position as an international I&T centre. HKPC is also the first institution recognised by Hong Kong’s Civil Aviation Department as an Advanced Small Unmanned Aircraft Training Organisation and holder of Advanced Operation Authorisation. We will continue to lead in system building and talent development.”
Connecting upstream, midstream, and downstream: HKPC Develops an Innovative Low-Altitude Economy Industry Chain
In promoting the low-altitude economy, HKPC has linked the entire industry chain, integrating upstream – materials, manufacturing, and energy technologies, midstream – standards and testing platforms, and downstream – application deployment, infrastructure, and talent training:
- Upstream technology R&D: HKPC supports the development of hydrogen fuel cells, thermoplastic composite gas cylinders, microelectronic modules, and magnesium alloy materials and manufacturing to enhance drone endurance and structural light-weighting. Through 3D printing of drone components, HKPC bolsters local smart manufacturing capabilities. Successful cases include a self-developed carbon fiber–metal foam composite that simultaneously improves structural rigidity and airframe light-weighting.
- Midstream standards and institutional building: HKPC collaborates with Institute of Electrical and Electronics Engineers (IEEE), the Greater Bay Area Standards Innovation Alliance, and others to establish risk-based standards, cross-border logistics standards, and other related manufacturing standards for regulatory sandboxes in the low-altitude economy, providing unified frameworks and risk thresholds for government, enterprises, and technology providers. HKPC is also Hong Kong’s first Civil Aviation Department–recognized advanced training organisation for small unmanned aircraft. It is currently preparing to launch Category C small unmanned aircraft (25–150 kg) courses to align with the regulatory framework under the Small Unmanned Aircraft Order (Cap. 448G).
- Downstream application enablement: HKPC actively promotes drone deployment in scenarios such as logistics delivery, bridge inspection, emergency rescue, and power grid monitoring. Achievements include the Edison Gold Award–winning “Autonomous Air-ground Cooperative Tunnel Inspector,” combining edge AI computing, high-precision Non-GPS Positioning, and a multi-robot ground–air collaborative solution. Not only does it greatly reduce the need for working at heights, but also makes tunnel inspections safer and more efficient; and the “EagleEye Power Grid Inspection System,” a Gold Award winner at the Geneva International Exhibition of Inventions, which uses embedded AI for real-time defect detection to enhance inspection efficiency and safety.
Exhibition × Sandbox × Go Global: The Low-altitude Economy Tech Hall as a one-stop I&T platform
As a pioneer in strengthening the low-altitude economy value chain, HKPC remains at the forefront of industry development. Located at the HKPC Building, the “Low-altitude Economy Tech Hall” features nearly 20 cutting-edge technologies from Hong Kong and the Mainland, spanning the entire value chain, including technical standard settings, materials and manufacturing technologies, eVTOL, medium-sized unmanned aircraft technologies, low-altitude digitalisation infrastructure, air traffic management, geographic information systems, and various types of application scenarios—showcasing Hong Kong’s technical strength and collaborative potential in the low-altitude economy. In addition, it will offer hands-on operation experiences with small unmanned aircraft, allowing visitors to personally experience the appeal of frontier technologies.
The “Low-altitude Economy Tech Hall” also aligns with the Government’s “regulatory sandbox” policy by establishing institutional testing scenarios that allow enterprises, government, and academia to test technologies, validate regulations, and promote policy coordination within a controlled environment. Industry partners are welcome to visit and exchange insights, and the public is invited to explore the technological achievements of the low-altitude economy. Reservations for visits are available via this link.
Please click here for hi-res photos
Hashtag: #HKPC #Low-altitudeEconomyTechHall
The issuer is solely responsible for the content of this announcement.
About Hong Kong Productivity Council
The Hong Kong Productivity Council (HKPC) is a multi-disciplinary organisation established by statute in 1967, to promote productivity through relentless drive of world-class advanced technologies and innovative service offerings to support Hong Kong enterprises. As a nationwide leader in innovative, market-driven research and development (R&D), specialising in leading technologies and all-rounded manufacturing services, HKPC promotes new industrialisation in Hong Kong and the Chinese Mainland and facilitates the development of new productive forces, leveraging innovation and technology (I&T), as well as bolstering Hong Kong to be an international innovation and technology centre and a smart city. The Council offers comprehensive innovative solutions for Hong Kong industries and enterprises to enhance competitiveness. To further support businesses in expanding into global markets, HKPC has established “The Cradle – Go Global Service Centre”, providing essential services to address businesses’ needs in product development, technology, manufacturing, and management, empowering enterprises to successfully go global. The Council partners and collaborates with local industries and enterprises and world-class R&D institutes to promote technology transfer, product innovation, and commercialisation through product innovation, technology transfer, creating value for industries. HKPC’s world-class R&D achievements have been widely recognised over the years, winning an array of local and overseas accolades.
In addition, HKPC offers SMEs and startups immediate and timely assistance in coping with the ever-changing business environment, and strengthens talent nurturing and Hong Kong’s competitiveness with FutureSkills training for enterprises and academia to enhance digital capabilities and STEM competencies.
For more information, please visit HKPC’s website: www.hkpc.org/en.
Available in Six Expressive Colorways, HYTE’s Latest PC Case Delivers Perfect Balance of Form and Function with Accessible Pricing
CALIFORNIA, UNITED STATES – Media OutReach Newswire – 19 December 2025 – HYTE, a leading manufacturer of cutting-edge PC components and peripherals, announces its highly anticipated X50 and X50 Air Modern Performance Cases are now available. Following its successful Computex 2025 debut, the X50 cases are meticulously designed chassis engineered with premium materials and finishes for incredible durability, while maintaining a builder-friendly experience with tool-less panels, integrated cable management, and future-proof component compatibility.
HYTE’s new X50 and X50 Air cases redefine traditional PC chassis design with fully rounded construction and built-in performance optimizations. These include a Full-Coverage Micro-Mesh front panel for low-pressure air intake, HYTE’s patent-pending Louvered Blade Ventilation on the back which reduces exhaust impedance while reinforcing rigidity, and a structural top-mounted PSU canopy enabling hassle-free cable management. Both cases feature massive 360mm radiator support on front and side, with total capacity for up-to-10 fans, including up to 3x 120mm extra-thick fans on the bottom for cold-floor GPU cooling.
Key features include:
- Premium Build Materials – 1mm-thick steel improves chassis strength and durability. Manufactured with Automotive-Grade Tooling, the X50 has 4x tighter tolerances than other PC cases, achieving its signature rounded curves
- Superior Build Experiences – The rounded design contributes to a comfortable build experience. Its tool-less front and side panels, covertly routed cable-routing channels, and spacious interiors lets anyone build in the X50 with no obstructions.
- Distinct Aesthetic Options – X50 features sweeping curved 4mm-thick laminated acoustic glass for maximum visibility and noise dampening. X50 Air uses curved Full-Coverage Micro-Mesh panel for enhanced airflow. X50 Air available in Snow White and Pitch Black; standard X50 in Snow White, Pitch Black, Wild Cherry, Taro Milk, Strawberry Milk, and Matcha Milk
WEBSITE: https://hyte.com/store/x50
Hashtag: #HYTE
The issuer is solely responsible for the content of this announcement.
ABOUT HYTE
HYTE is a lifestyle-centered brand enhancing play with innovative PC components and accessories. Designed for gaming, music, arts and entertainment, all HYTE products are rigorously researched and tested. Visit: 
http://www.hyte.com
Available in Six Expressive Colorways, HYTE’s Latest PC Case Delivers a Perfect Balance of Form and Function Through its Disciplined Multi-Dimensional Design Complete with Accessible Pricing
CALIFORNIA, UNITED STATES – Media OutReach Newswire – 19 December 2025 – HYTE, a leading manufacturer of cutting-edge PC components and peripherals, is excited to announce that its highly anticipated X50 and X50 Air Modern Performance Cases are now available. Following its successful Computex 2025 debut, the X50 cases are meticulously designed PC chassis that are engineered with premium materials and finishes that allow for incredible durability, while maintaining a builder-friendly experience with its tool-less panels, integrated cable management solutions, and future-proof component compatibility.
HYTE’s new X50 and X50 Air cases redefine traditional PC chassis design, as both cases feature a fully rounded design with several built-in performance optimizations. These include a Full-Coverage Micro-Mesh front panel for low-pressure and low-resistance air intake, HYTE’s patent-pending Louvered Blade Ventilation on the back of the case which reduces exhaust impedance while reinforcing case rigidity, and a structural top-mounted PSU canopy that lets the PSU act as an exhaust fan while opening up hassle-free cable management. Both the X50 and X50 Air feature massive 360mm radiator support on the front and side of the case, with a total capacity of up-to-10 fans, including up to 3x 120mm extra-thick fans on the case’s bottom for cold-floor cooling that keeps any GPU comfortably cool.
Other key features of the X50 and X50 Air Modern Performance Cases include:
- Premium Build Materials – Both cases use 1mm-thick steel that improves chassis strength and durability. Manufactured with Automotive-Grade Tooling, the X50 has 4x tighter tolerances than other PC cases, which allows HYTE to achieve the X50’s rounded compounded curves
- Superior Build Experiences – The X50 and X50 Air’s rounded design contributes to the ease of any build without being harsh on a builder’s hands. Its tool-less front and side panels, covertly routed cable-routing channels, and spacious interiors lets anyone build in the X50 with no obstructions.
- Distinct Aesthetic Options – The X50 comes with a sweeping curved 4mm-thick laminated acoustic glass for maximum visibility and passive noise dampening. The X50 Air swaps the glass panel with a curved Full-Coverage Micro-Mesh panel that enhances the case’s airflow capabilities. While the X50 Air only comes in Snow White and Pitch Black, the standard X50 will be available in Snow White, Pitch Black, Wild Cherry, Taro Milk, Strawberry Milk, and Matcha Milk colorways.
WEBSITE:
To know more about an X50 or an X50 Air Modern Performance Case, please visit: https://hyte.com/store/x50
Hashtag: #HYTE
The issuer is solely responsible for the content of this announcement.
ABOUT HYTE
HYTE is a lifestyle-centered brand focused on enhancing play with its fresh and innovative PC components and accessories. Designed to fuel passions in gaming, music, the arts and entertainment, all HYTE products are rigorously researched and tested before they are brought to fruition. HYTE, as a company and its products, are inspired by the needs and behaviors of its community and the many ways people play. HYTE is committed to designing products to help people experience play throughout their lifestyle, no matter what that may be. To learn more, please visit: 
http://www.hyte.com
Work-Integrated Learning Matters
Work-Integrated Learning bridges the gap between classroom theory and practical application. By immersing students in authentic work environments, internships cultivate essential skills beyond technical knowledge, including cognitive abilities such as problem-solving, affective traits like emotional intelligence, and psychomotor skills that enhance hands-on performance. Graduates who master these dimensions stand out as versatile professionals ready to contribute from day one, shaping leaders of the future who can drive innovation and growth.
The SIM60 WILL Award: Setting Graduates Apart
The SIM60 WILL Award is more than a recognition, it is a testament to resilience and excellence. Students who complete internships successfully and demonstrate perseverance in challenging situations are honoured for their commitment to growth. This award signals to employers that recipients are not only academically competent but also workplace-ready, equipped with the adaptability and grit that modern industries demand. It reinforces SIM’s mission to foster sustainable employment by preparing graduates for long-term career success.
Success Stories That Inspire
Recipients of the SIM60 WILL Award come from varied academic and personal backgrounds, yet many share a common pathway: leveraging work-integrated learning experiences to strengthen their career readiness. Several award recipients have used internships to apply classroom knowledge to real business environments, developing data dashboards, automating processes, supporting cybersecurity initiatives, and contributing to enterprise-level digital projects.
For some, these internships have served as stepping stones to contract or full-time roles in areas such as business analysis, project management and data operations. Others have progressed to subsequent placements in high growth sectors, where exposure to real world challenges has helped refine their technical skills and broaden their understanding of industry expectations.
These experiences reflect SIM’s commitment in shaping leaders of the future and fostering Sustainable Employment through Work-Integrated Learning, demonstrating how structured internships, supported by SIM’s guidance and reinforced through the WILL Award, equip learners with practical competencies and professional confidence to navigate evolving career landscapes.
Impact on Employability
Internship experience is a proven differentiator in hiring decisions. According to global employability studies, candidates with practical exposure are significantly more likely to secure roles and advance in their careers. The SIM60 WILL Award amplifies this advantage by validating the quality of a student’s internship performance. For employers, it serves as a trusted benchmark of talent. For graduates, it opens doors to opportunities that might otherwise remain out of reach, enhancing employability in a rapidly evolving economy.
Key Takeaways
The SIM60 WILL Award reflects SIM’s ongoing efforts to integrate work experience into education, supporting students in building practical skills that complement academic learning. By recognizing internship excellence, the award highlights the importance of resilience and adaptability in preparing graduates for the evolving job market.
References:
- SIM60 WILL Award/Career Service – https://www.sim.edu.sg/degrees-diplomas/life-at-sim/career-services
- Ng Jing Heng on Turning an Internship into a Career Launchpad – https://www.sim.edu.sg/articles-inspirations/ng-jing-heng-on-turning-an-internship-into-a-career-launchpad
- Chen Soon Keat’s Journey from Intern to Innovator – https://www.sim.edu.sg/articles-inspirations/chen-soon-keat-journey-from-intern-to-innovator
Hashtag: #SIMGlobalEducation #SIMGE #GlobalEducation #InternationalDegree #CareerReady #FutureSkills
The issuer is solely responsible for the content of this announcement.
About SIM Global Education
SIM Global Education (SIM GE) is a leading private education institution in Singapore and the region. We offer more than 140 academic programmes ranging from diplomas and graduate diploma programmes to bachelor’s and master’s degree programmes with some of the world’s most reputable universities from Australia, Canada, Europe, United Kingdom, and the United States. SIM GE’s cohort is made up of 16,000 full- and part-time students and adult learners, of which approximately 36% are international students hailing from over 50 countries.
SIM GE’s holistic learning approach and culturally diverse learning environment aim to equip students with knowledge, industry skills and employability competencies, as well as a global perspective to succeed as future leaders in a fast-changing, technologically driven world.
For more information on SIM Global Education, visit sim.edu.sg
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