Media OutReach

HKPC Makes Its Debut at China International Industry Fair 2025

Published

3 months ago

15/09/2025

Leading Future Manufacturing with AI
Taking 54 Hong Kong Enterprises to Explore Overseas Opportunities

HONG KONG SAR – Media OutReach Newswire – 15 September 2025 – Hong Kong Productivity Council (HKPC) will make its debut at the China International Industry Fair (CIIF)—one of the largest and most influential industrial exhibitions in the country—from September 23 to 27 in Shanghai. HKPC will showcase Hong Kong’s outstanding achievements in innovation and technology applications led by artificial intelligence (AI) to industry leaders, enterprises, and investors from around the world. In addition, HKPC has organised a delegation of representatives from 54 Hong Kong enterprises to attend the CIIF, where they will discuss with Mainland enterprises on cutting-edge technologies in new industrialisation, and leverage Hong Kong’s international platform to explore new opportunities in overseas markets.

The HKPC booth, located at D005 in Hall 1.1 of the National Exhibition and Convention Center (Shanghai), showcases Hong Kong’s outstanding achievements in technology applications to industry leaders, enterprises, and investors from around the world.

This year’s CIIF features smart manufacturing and new productive forces, bringing together approximately 3,000 exhibitors and representatives from various countries and regions worldwide. As the only Hong Kong public organisation participating in the event, HKPC will spotlight globally leading agentic AI technologies, and present research achievements in areas including robotics, microfactory and green technology. Among these are innovative solutions that have received international recognition, including the Geneva Jury Commendation Gold Award and the Asia Exhibition of Innovation and Invention Silver Award. The exhibition will fully demonstrate Hong Kong’s innovative strengths in driving industrial upgrading and transformation, actively promote the “go global” of Mainland and local industries, and connect with global markets.

Hon Sunny TAN, Chairman of HKPC, said, “HKPC is delighted to participate in the CIIF for the first time. In addition to showcasing self-developed agentic AI innovative solutions, AI-powered robotics, and green technologies, we aim to demonstrate Hong Kong’s technological strengths and international competitiveness. We also look forward to engaging with enterprises from across the country, helping them understand Hong Kong’s unique “One Country, Two Systems” advantage and internationalised environment. This will support enterprises in going global and leveraging the HKPC platform—including the newly established ‘The Cradle — Go Global Service Centre’ which provides one-stop support for market navigation, technical certification, and partnership matching, enabling companies to connect with international resources and explore new business development directions. At the same time, we are actively collaborating with Invest Hong Kong, the Office for Attracting Strategic Enterprises, the Hong Kong Trade Development Council, local universities, and other ‘government, industry, academia, research, and investment’ organisations to create synergy. Together, we offer comprehensive, diversified, and efficient support for enterprises to go global and innovate, further elevating the reputation of ‘Made in China’ on the international stage.

Hosting Tech Talk and Industry Networking Events with Over 100 Representatives Sharing Insights

In August, the State Council released the guideline on implementing the “AI Plus” initiative, aiming to achieve deep integration of AI with six key sectors—including manufacturing and transportation—by 2027. The guidelines also set a target for the penetration rate of new-generation intelligent terminals and AI agents expected to surpass 70%. HKPC will continue to work closely with industry partners to actively drive the application of AI, seizing the vast opportunities brought by industrial intelligence and the national strategy for new productive forces.

HKPC will host a series of expert technical seminars at the exhibition venue from 23 to 25 September, focusing on cutting-edge topics such as agentic AI, smart manufacturing, materials innovation, and the integration of large language models (LLMs) with point cloud technology. These sessions aim to share innovative insights and experiences with industry peers worldwide. During the exhibition, a variety of interactive networking activities will also take place, including the “New Productive Forces Meet-up” on 23 September, which will bring together over 100 representatives from government, business, and academia to explore the integration of innovation and industrial growth. On 24 September, the “Industry Network Clusters (Shanghai)” will help technology enterprises seize new opportunities for going global, formulate international development strategies, and foster industrial internationalization and cooperation.

HKPC cordially invites professionals from government, industry, academia, research, and investment sectors to visit Booth D005 in Hall 1.1 at the National Exhibition and Convention Center (Shanghai). Experience interactive demonstrations, engage with experts on the latest technologies, and gain in-depth understanding of Hong Kong’s innovation ecosystem and collaboration opportunities, working together to drive continuous industrial upgrading.

Visitors can register for free admission on the official event website on or before 20 September.

2025 CIIF HKPC Key Exhibits

Agentic AI Automation Platform “AIM“: AIM is a universal, comprehensive AI data management platform that combines real-time visual AI monitoring, RAG technology, and IoT devices to deliver new experiences in intelligent decision-making, task assignment, and process optimization for enterprises. Designed to empower a wide range of industries, AIM effectively shortens the development cycle for new application scenarios and enhances advanced manufacturing efficiency.
AI Autonomous Wheelchair: This solution integrates AI, multi-sensor fusion, 5G communication, and edge computing to enable autonomous path planning, positioning, and map building for barrier-free and efficient point-to-point transport services. The system features a fleet management platform with real-time monitoring and is suitable for deployment in airports, large shopping malls, hospitals, and smart campuses.
Robotics: The 3D scanning robot “Inspection Buddy” demonstrates cutting-edge human-machine collaboration and industrial automation solutions, further enhancing production efficiency and precision. The Industrial Humanoid Robot can perform complex industrial tasks that require human-like dexterity, flexibility, and interactive capabilities.
Microfactory and Green Technology: Showcasing a highly integrated, flexible, and efficient smart microfactory model, including an “WareMind” that has won silver awards at the 49^th Geneva International Exhibition of Inventions and the 3^rd Asia Exhibition of Innovations and Inventions Hong Kong. In green technology, the focus is on the transformation of the environmental industry, with the exhibition of the “Smart Autonomous EV Charging Robot,” which received the gold medal at the 49^th Geneva International Exhibition of Inventions. This robot integrates an unmanned robotic chassis, battery pack, charger, and robotic arm, enabling flexible deployment in various parking lots and providing charging services at any location through a mobile app.

2025 CIIF HKPC Event Highlights

Time	23/9 (Tuesday)	24/9 (Wednesday)	25/9 (Thursday)	26/9 (Friday)	27/9 (Saturday)
11:15 – 11:30	/	Robots Show
11:00 – 11:30	/	Tech Talk AI-powered Machine Vision	Tech Talk AIM:Agentic AI Empowering Modern Industry	Tech Talk Gamification Leading the Future of Smart Manufacturing	/
14:15 – 14:30	Robots Show
14:30 – 15:00	Tech Talk From “Manufacturing” to “Smart Manufacturing”: Hongrita × HKPC Co-create New Heights in Intelligent Manufacturing	Tech Talk Empowering Future Manufacturing: A New Paradigm Driven by Advanced Materials	Tech Talk Smart Inspection: A New Era of Indoor Inspection with Point Cloud Technology and Large Language Models	/	/
15:00 – 15:30	/	Industry Network Clusters (Shanghai) Going Global: Service and Enterprise Sharing Session	/	/	/
15:30 – 16:00	New Productive Forces Meet-up
16:00 – 16:30	New Productive Forces Meet-up	/

Hashtag: #HongKongProductivityCouncil

The issuer is solely responsible for the content of this announcement.

About Hong Kong Productivity Council

The Hong Kong Productivity Council (HKPC) is a multi-disciplinary organisation established by statute in 1967, to promote productivity excellence through relentless drive of world-class advanced technologies and innovative service offerings to support Hong Kong enterprises. As a nationwide leader in innovative, market-driven research and development (R&D), specialising in leading technologies and all-rounded manufacturing services, HKPC promotes new industrialisation in Hong Kong and the Greater Bay Area and facilitates the development of new productive forces, leveraging innovation and technology (I&T), as well as bolstering Hong Kong to be an international innovation and technology centre and a smart city. The Council offers comprehensive innovative solutions for Hong Kong industries and enterprises, enabling them to achieve resources and productivity utilisation, effectiveness and cost reduction, and enhance competitiveness in both local and overseas marketplace. The Council partners and collaborates with local industries and enterprises and world-class R&D institutes to develop applied technology solutions for value creation. It also benefits a variety of sectors through product innovation, technology transfer, and commercialisation, bringing enormous business opportunities ahead. HKPC’s world-class R&D achievements have been widely recognised over the years, winning an array of local and overseas accolades.

In addition, HKPC offers SMEs and startups immediate and timely assistance in coping with the ever-changing business environment, and strengthens talent nurturing and Hong Kong’s competitiveness with FutureSkills training for enterprises and academia to enhance digital capabilities and STEM competencies.

For more information, please visit HKPC’s website: www.hkpc.org/en.

Media OutReach

HYTE’S X50 and X50 Air Modern Performance Cases Now Available

Published

19 hours ago

19/12/2025

Media Outreach

Available in Six Expressive Colorways, HYTE’s Latest PC Case Delivers Perfect Balance of Form and Function with Accessible Pricing

CALIFORNIA, UNITED STATES – Media OutReach Newswire – 19 December 2025 – HYTE, a leading manufacturer of cutting-edge PC components and peripherals, announces its highly anticipated X50 and X50 Air Modern Performance Cases are now available. Following its successful Computex 2025 debut, the X50 cases are meticulously designed chassis engineered with premium materials and finishes for incredible durability, while maintaining a builder-friendly experience with tool-less panels, integrated cable management, and future-proof component compatibility.

HYTE’S X50 AND X50 AIR MODERN PERFORMANCE CASES

HYTE’s new X50 and X50 Air cases redefine traditional PC chassis design with fully rounded construction and built-in performance optimizations. These include a Full-Coverage Micro-Mesh front panel for low-pressure air intake, HYTE’s patent-pending Louvered Blade Ventilation on the back which reduces exhaust impedance while reinforcing rigidity, and a structural top-mounted PSU canopy enabling hassle-free cable management. Both cases feature massive 360mm radiator support on front and side, with total capacity for up-to-10 fans, including up to 3x 120mm extra-thick fans on the bottom for cold-floor GPU cooling.

Key features include:

Premium Build Materials – 1mm-thick steel improves chassis strength and durability. Manufactured with Automotive-Grade Tooling, the X50 has 4x tighter tolerances than other PC cases, achieving its signature rounded curves
Superior Build Experiences – The rounded design contributes to a comfortable build experience. Its tool-less front and side panels, covertly routed cable-routing channels, and spacious interiors lets anyone build in the X50 with no obstructions.
Distinct Aesthetic Options – X50 features sweeping curved 4mm-thick laminated acoustic glass for maximum visibility and noise dampening. X50 Air uses curved Full-Coverage Micro-Mesh panel for enhanced airflow. X50 Air available in Snow White and Pitch Black; standard X50 in Snow White, Pitch Black, Wild Cherry, Taro Milk, Strawberry Milk, and Matcha Milk

WEBSITE: https://hyte.com/store/x50

Hashtag: #HYTE

The issuer is solely responsible for the content of this announcement.

ABOUT HYTE

HYTE is a lifestyle-centered brand enhancing play with innovative PC components and accessories. Designed for gaming, music, arts and entertainment, all HYTE products are rigorously researched and tested. Visit: http://www.hyte.com

Media OutReach

HYTE’S Soft & Curvy X50 and X50 Air Modern Performance Cases Now Readily Available

Published

19 hours ago

19/12/2025

Media Outreach

Available in Six Expressive Colorways, HYTE’s Latest PC Case Delivers a Perfect Balance of Form and Function Through its Disciplined Multi-Dimensional Design Complete with Accessible Pricing

CALIFORNIA, UNITED STATES – Media OutReach Newswire – 19 December 2025 – HYTE, a leading manufacturer of cutting-edge PC components and peripherals, is excited to announce that its highly anticipated X50 and X50 Air Modern Performance Cases are now available. Following its successful Computex 2025 debut, the X50 cases are meticulously designed PC chassis that are engineered with premium materials and finishes that allow for incredible durability, while maintaining a builder-friendly experience with its tool-less panels, integrated cable management solutions, and future-proof component compatibility.

HYTE’S X50 AND X50 AIR MODERN PERFORMANCE CASES

HYTE’s new X50 and X50 Air cases redefine traditional PC chassis design, as both cases feature a fully rounded design with several built-in performance optimizations. These include a Full-Coverage Micro-Mesh front panel for low-pressure and low-resistance air intake, HYTE’s patent-pending Louvered Blade Ventilation on the back of the case which reduces exhaust impedance while reinforcing case rigidity, and a structural top-mounted PSU canopy that lets the PSU act as an exhaust fan while opening up hassle-free cable management. Both the X50 and X50 Air feature massive 360mm radiator support on the front and side of the case, with a total capacity of up-to-10 fans, including up to 3x 120mm extra-thick fans on the case’s bottom for cold-floor cooling that keeps any GPU comfortably cool.

Other key features of the X50 and X50 Air Modern Performance Cases include:

Premium Build Materials – Both cases use 1mm-thick steel that improves chassis strength and durability. Manufactured with Automotive-Grade Tooling, the X50 has 4x tighter tolerances than other PC cases, which allows HYTE to achieve the X50’s rounded compounded curves
Superior Build Experiences – The X50 and X50 Air’s rounded design contributes to the ease of any build without being harsh on a builder’s hands. Its tool-less front and side panels, covertly routed cable-routing channels, and spacious interiors lets anyone build in the X50 with no obstructions.
Distinct Aesthetic Options – The X50 comes with a sweeping curved 4mm-thick laminated acoustic glass for maximum visibility and passive noise dampening. The X50 Air swaps the glass panel with a curved Full-Coverage Micro-Mesh panel that enhances the case’s airflow capabilities. While the X50 Air only comes in Snow White and Pitch Black, the standard X50 will be available in Snow White, Pitch Black, Wild Cherry, Taro Milk, Strawberry Milk, and Matcha Milk colorways.

WEBSITE:
To know more about an X50 or an X50 Air Modern Performance Case, please visit: https://hyte.com/store/x50
Hashtag: #HYTE

http://www.hyte.com

The issuer is solely responsible for the content of this announcement.

ABOUT HYTE

HYTE is a lifestyle-centered brand focused on enhancing play with its fresh and innovative PC components and accessories. Designed to fuel passions in gaming, music, the arts and entertainment, all HYTE products are rigorously researched and tested before they are brought to fruition. HYTE, as a company and its products, are inspired by the needs and behaviors of its community and the many ways people play. HYTE is committed to designing products to help people experience play throughout their lifestyle, no matter what that may be. To learn more, please visit: http://www.hyte.com

Media OutReach

SIM60 WILL Award: Elevating Employability Through Work-Integrated Learning

Published

20 hours ago

19/12/2025

Media Outreach

SINGAPORE – Media OutReach Newswire – 19 December 2025 – In today’s competitive job market, academic excellence alone is no longer sufficient for career success. Employers increasingly value graduates who demonstrate resilience, adaptability, and real-world experience. To address this shift, SIM has introduced the SIM60 Work-Integrated Learning (WILL) Award, a prestigious accolade that celebrates students who excel in internships and embody qualities essential for thriving in the workplace.

Work-Integrated Learning Matters

Work-Integrated Learning bridges the gap between classroom theory and practical application. By immersing students in authentic work environments, internships cultivate essential skills beyond technical knowledge, including cognitive abilities such as problem-solving, affective traits like emotional intelligence, and psychomotor skills that enhance hands-on performance. Graduates who master these dimensions stand out as versatile professionals ready to contribute from day one, shaping leaders of the future who can drive innovation and growth.

The SIM60 WILL Award: Setting Graduates Apart

The SIM60 WILL Award is more than a recognition, it is a testament to resilience and excellence. Students who complete internships successfully and demonstrate perseverance in challenging situations are honoured for their commitment to growth. This award signals to employers that recipients are not only academically competent but also workplace-ready, equipped with the adaptability and grit that modern industries demand. It reinforces SIM’s mission to foster sustainable employment by preparing graduates for long-term career success.

Success Stories That Inspire

Recipients of the SIM60 WILL Award come from varied academic and personal backgrounds, yet many share a common pathway: leveraging work-integrated learning experiences to strengthen their career readiness. Several award recipients have used internships to apply classroom knowledge to real business environments, developing data dashboards, automating processes, supporting cybersecurity initiatives, and contributing to enterprise-level digital projects.

For some, these internships have served as stepping stones to contract or full-time roles in areas such as business analysis, project management and data operations. Others have progressed to subsequent placements in high growth sectors, where exposure to real world challenges has helped refine their technical skills and broaden their understanding of industry expectations.

These experiences reflect SIM’s commitment in shaping leaders of the future and fostering Sustainable Employment through Work-Integrated Learning, demonstrating how structured internships, supported by SIM’s guidance and reinforced through the WILL Award, equip learners with practical competencies and professional confidence to navigate evolving career landscapes.

Impact on Employability

Internship experience is a proven differentiator in hiring decisions. According to global employability studies, candidates with practical exposure are significantly more likely to secure roles and advance in their careers. The SIM60 WILL Award amplifies this advantage by validating the quality of a student’s internship performance. For employers, it serves as a trusted benchmark of talent. For graduates, it opens doors to opportunities that might otherwise remain out of reach, enhancing employability in a rapidly evolving economy.

Key Takeaways

The SIM60 WILL Award reflects SIM’s ongoing efforts to integrate work experience into education, supporting students in building practical skills that complement academic learning. By recognizing internship excellence, the award highlights the importance of resilience and adaptability in preparing graduates for the evolving job market.

References:

SIM60 WILL Award/Career Service – https://www.sim.edu.sg/degrees-diplomas/life-at-sim/career-services
Ng Jing Heng on Turning an Internship into a Career Launchpad – https://www.sim.edu.sg/articles-inspirations/ng-jing-heng-on-turning-an-internship-into-a-career-launchpad
Chen Soon Keat’s Journey from Intern to Innovator – https://www.sim.edu.sg/articles-inspirations/chen-soon-keat-journey-from-intern-to-innovator

Hashtag: #SIMGlobalEducation #SIMGE #GlobalEducation #InternationalDegree #CareerReady #FutureSkills

https://www.sim.edu.sg/

The issuer is solely responsible for the content of this announcement.

About SIM Global Education

SIM Global Education (SIM GE) is a leading private education institution in Singapore and the region. We offer more than 140 academic programmes ranging from diplomas and graduate diploma programmes to bachelor’s and master’s degree programmes with some of the world’s most reputable universities from Australia, Canada, Europe, United Kingdom, and the United States. SIM GE’s cohort is made up of 16,000 full- and part-time students and adult learners, of which approximately 36% are international students hailing from over 50 countries.

SIM GE’s holistic learning approach and culturally diverse learning environment aim to equip students with knowledge, industry skills and employability competencies, as well as a global perspective to succeed as future leaders in a fast-changing, technologically driven world.

For more information on SIM Global Education, visit sim.edu.sg