Media OutReach
Suanova Information, a Yeebo’s Subsidiary, Makes Its Debut at the 2025 WAIC
Securing a Key Role in China’s AI Computing Power Sector Driving Industry Innovation and Development
HONG KONG SAR – Media OutReach Newswire – 30 July 2025 – Suanova Information (Shanghai) Limited (“Suanova Information”), a wholly-owned subsidiary of Yeebo (International Holdings) Limited (“Yeebo” or the “Company”, stock code: 259, which together with its subsidiaries is referred to as the “Group”) made its debut at the 2025 World Artificial Intelligence Conference (“WAIC”) held in Shanghai from 26 to 29 July, and hosted a major forum.
Suanova Information, under Yeebo, focuses on three business areas covering compute power and cloud operations, computing industry investment and computing technology development. It aims to accelerate the deep integration and application of AI across various sectors through independent innovation. As a domestic cloud computing pioneer, Suanova Information offers professional, independent, and innovative one-stop services to enterprises in China. With branches in Hong Kong and Shanghai, it provides customers with better localized services. Leveraging strategic investments, partnerships, and an openness to new technologies, Suanova Information has developed solid and full-stack service capabilities, from core components to application deployment, solidifying its position as a major player in mainland China’s AI compute.
At the 2025 WAIC, Suanova Information, alongside several technology companies from its computing investment portfolio, presented its comprehensive industry ecosystem to attendees from around the world. Together, they showcased various core computing components, solutions, and practical case studies.
Suanova Information also leveraged this opportunity to demonstrate its compute power and cloud operational capabilities. The Group currently manages advanced, fully autonomous AI computing infrastructure in Hong Kong and Shanghai – the “Harvest” series intelligent computing centers. These centers operate Artificial Intelligence Data Centers (“AIDC”) housing over 3,000 GPU card clusters. Their client base spans industry and research institutions, including Tsinghua University, Fudan University, Shanghai Jiao Tong University, Shanghai Artificial Intelligence Laboratory, Institute for Advanced Algorithms Research, Shanghai, and Hong Kong Broadband Network (“HKBN”). The “Harvest” series clusters are distinguished by their leading domestic localization, high-grade network and high-speed storage, seamless integration with public and computing clouds, flexible delivery models, an independently controllable private computing platform, and high-level SLA services, all designed to provide clients with stable and efficient AI computing support.
Beyond its role as an exhibitor, Suanova Information, together with its industry chain partners, hosted the “Suanova Information: Intelligent Convergence in the East, Connecting Global Ecosystems Forum” in the afternoon of 27 July. The forum focused on two major topics: “Domestic Full-Stack Integration” and “Shanghai-Hong Kong Cooperation Towards the World”. It convened domestic and international experts, academics, and industry leaders to discuss the latest advancements in computing and AI technology, explore industry ecosystem collaboration, and address the opportunities and challenges for Chinese technology expanding globally.
The forum commenced with an opening speech by Mr. Zhang Hongtao, Deputy Director of the Shanghai Municipal Commission of Economy and Informatization, followed by a welcome address from Mr. Fang Yan Tak, Douglas, Chairman of Yeebo. The forum featured keynote speeches from academic and industry leaders, including Professor Tim Kwang Ting Cheng, Vice-President for Research and Development of the Hong Kong University of Science and Technology; Mr. Wang Yanfeng, Executive Dean of the School of Artificial Intelligence at Shanghai Jiao Tong University and Chairman of the Board of Directors of Shanghai Jiao Tong University Industrial Innovation Research Institute; Dr. Suo Guang of KylinSoft Corporation; Mr. Xu Runan, Senior Vice President and President of the Cloud and Computing Storage Product Line at H3C Technologies Co., Ltd.; and Dr. Denis Yip, President and Group Chief Operating Officer of HKBN Group. Additionally, academic experts, founders, and senior management teams from various renowned universities and enterprises participated in panel discussions and sharing sessions. During the forum, guests shared the story behind the creation of the domestic high-density cabinet, “Shanghai Cube,” and their experiences in building and operating the first “Shanghai-produced card” computing power cluster with a thousand-card scale.
In his welcome address, Mr. Fang Yan Tak, Douglas, Chairman of Yeebo, remarked: “The aspiration of Suanova Information is to provide crucial financial support to outstanding technology enterprises, and to do everything to assist the companies we invest in, especially during challenging times. Suanova Information is committed to being a pioneer in the market, leading the charge in the adoption of domestic AI products powered by Chinese computing capabilities. We believe in fostering open partnerships, and aim to bring exceptional ‘Shanghai Solutions’ and Chinese technology to the market – from Shanghai to Hong Kong, and from China to the world.”
Through the significant effort and investments in AI compute and related businesses in the past two years and Yeebo has established itself as one of the key players in the AI arena in mainland China. Leveraging targeted investments in scalable infrastructure, strategic partnerships, and an open-minded approach to emerging technologies, Yeebo has built a foundation that aligns with the accelerating demand for AI solutions across industries. These initiatives not only strengthen Yeebo’s competitive positioning but also reinforcing its commitment to delivering consistent growth in a rapidly evolving market. Yeebo’s strategic groundwork laid in AI compute and related businesses has positioned the Group for meaningful and sustained growth in the years ahead.
Hashtag: #Yeebo #Suanova
The issuer is solely responsible for the content of this announcement.
About Yeebo (International Holdings) Limited
Founded in 1988, Yeebo (International Holdings) Limited is a diversified electronic component company with a well-established presence in the global market. The Company’s core business spans flat panel displays, OLED technologies and capacitors, serving a broad spectrum of industrial and consumer applications. Headquartered in Hong Kong, Yeebo operates its manufacturing operations primarily in the Guangdong and Jiangsu provinces, supporting a global sales network that ensures localized service and support for its international clientele.
In alignment with its long-term strategic vision, Yeebo is leveraging its robust operational foundation to expand into the Artificial Intelligence (“AI”) compute and related sectors. This initiative reflects the Company’s commitment to innovation and technological advancement, with the objective of positioning Yeebo as a leading and influential participant in the rapidly evolving AI industry across mainland China and Hong Kong.
Available in Six Expressive Colorways, HYTE’s Latest PC Case Delivers Perfect Balance of Form and Function with Accessible Pricing
CALIFORNIA, UNITED STATES – Media OutReach Newswire – 19 December 2025 – HYTE, a leading manufacturer of cutting-edge PC components and peripherals, announces its highly anticipated X50 and X50 Air Modern Performance Cases are now available. Following its successful Computex 2025 debut, the X50 cases are meticulously designed chassis engineered with premium materials and finishes for incredible durability, while maintaining a builder-friendly experience with tool-less panels, integrated cable management, and future-proof component compatibility.
HYTE’s new X50 and X50 Air cases redefine traditional PC chassis design with fully rounded construction and built-in performance optimizations. These include a Full-Coverage Micro-Mesh front panel for low-pressure air intake, HYTE’s patent-pending Louvered Blade Ventilation on the back which reduces exhaust impedance while reinforcing rigidity, and a structural top-mounted PSU canopy enabling hassle-free cable management. Both cases feature massive 360mm radiator support on front and side, with total capacity for up-to-10 fans, including up to 3x 120mm extra-thick fans on the bottom for cold-floor GPU cooling.
Key features include:
- Premium Build Materials – 1mm-thick steel improves chassis strength and durability. Manufactured with Automotive-Grade Tooling, the X50 has 4x tighter tolerances than other PC cases, achieving its signature rounded curves
- Superior Build Experiences – The rounded design contributes to a comfortable build experience. Its tool-less front and side panels, covertly routed cable-routing channels, and spacious interiors lets anyone build in the X50 with no obstructions.
- Distinct Aesthetic Options – X50 features sweeping curved 4mm-thick laminated acoustic glass for maximum visibility and noise dampening. X50 Air uses curved Full-Coverage Micro-Mesh panel for enhanced airflow. X50 Air available in Snow White and Pitch Black; standard X50 in Snow White, Pitch Black, Wild Cherry, Taro Milk, Strawberry Milk, and Matcha Milk
WEBSITE: https://hyte.com/store/x50
Hashtag: #HYTE
The issuer is solely responsible for the content of this announcement.
ABOUT HYTE
HYTE is a lifestyle-centered brand enhancing play with innovative PC components and accessories. Designed for gaming, music, arts and entertainment, all HYTE products are rigorously researched and tested. Visit: 
http://www.hyte.com
Available in Six Expressive Colorways, HYTE’s Latest PC Case Delivers a Perfect Balance of Form and Function Through its Disciplined Multi-Dimensional Design Complete with Accessible Pricing
CALIFORNIA, UNITED STATES – Media OutReach Newswire – 19 December 2025 – HYTE, a leading manufacturer of cutting-edge PC components and peripherals, is excited to announce that its highly anticipated X50 and X50 Air Modern Performance Cases are now available. Following its successful Computex 2025 debut, the X50 cases are meticulously designed PC chassis that are engineered with premium materials and finishes that allow for incredible durability, while maintaining a builder-friendly experience with its tool-less panels, integrated cable management solutions, and future-proof component compatibility.
HYTE’s new X50 and X50 Air cases redefine traditional PC chassis design, as both cases feature a fully rounded design with several built-in performance optimizations. These include a Full-Coverage Micro-Mesh front panel for low-pressure and low-resistance air intake, HYTE’s patent-pending Louvered Blade Ventilation on the back of the case which reduces exhaust impedance while reinforcing case rigidity, and a structural top-mounted PSU canopy that lets the PSU act as an exhaust fan while opening up hassle-free cable management. Both the X50 and X50 Air feature massive 360mm radiator support on the front and side of the case, with a total capacity of up-to-10 fans, including up to 3x 120mm extra-thick fans on the case’s bottom for cold-floor cooling that keeps any GPU comfortably cool.
Other key features of the X50 and X50 Air Modern Performance Cases include:
- Premium Build Materials – Both cases use 1mm-thick steel that improves chassis strength and durability. Manufactured with Automotive-Grade Tooling, the X50 has 4x tighter tolerances than other PC cases, which allows HYTE to achieve the X50’s rounded compounded curves
- Superior Build Experiences – The X50 and X50 Air’s rounded design contributes to the ease of any build without being harsh on a builder’s hands. Its tool-less front and side panels, covertly routed cable-routing channels, and spacious interiors lets anyone build in the X50 with no obstructions.
- Distinct Aesthetic Options – The X50 comes with a sweeping curved 4mm-thick laminated acoustic glass for maximum visibility and passive noise dampening. The X50 Air swaps the glass panel with a curved Full-Coverage Micro-Mesh panel that enhances the case’s airflow capabilities. While the X50 Air only comes in Snow White and Pitch Black, the standard X50 will be available in Snow White, Pitch Black, Wild Cherry, Taro Milk, Strawberry Milk, and Matcha Milk colorways.
WEBSITE:
To know more about an X50 or an X50 Air Modern Performance Case, please visit: https://hyte.com/store/x50
Hashtag: #HYTE
The issuer is solely responsible for the content of this announcement.
ABOUT HYTE
HYTE is a lifestyle-centered brand focused on enhancing play with its fresh and innovative PC components and accessories. Designed to fuel passions in gaming, music, the arts and entertainment, all HYTE products are rigorously researched and tested before they are brought to fruition. HYTE, as a company and its products, are inspired by the needs and behaviors of its community and the many ways people play. HYTE is committed to designing products to help people experience play throughout their lifestyle, no matter what that may be. To learn more, please visit: 
http://www.hyte.com
Work-Integrated Learning Matters
Work-Integrated Learning bridges the gap between classroom theory and practical application. By immersing students in authentic work environments, internships cultivate essential skills beyond technical knowledge, including cognitive abilities such as problem-solving, affective traits like emotional intelligence, and psychomotor skills that enhance hands-on performance. Graduates who master these dimensions stand out as versatile professionals ready to contribute from day one, shaping leaders of the future who can drive innovation and growth.
The SIM60 WILL Award: Setting Graduates Apart
The SIM60 WILL Award is more than a recognition, it is a testament to resilience and excellence. Students who complete internships successfully and demonstrate perseverance in challenging situations are honoured for their commitment to growth. This award signals to employers that recipients are not only academically competent but also workplace-ready, equipped with the adaptability and grit that modern industries demand. It reinforces SIM’s mission to foster sustainable employment by preparing graduates for long-term career success.
Success Stories That Inspire
Recipients of the SIM60 WILL Award come from varied academic and personal backgrounds, yet many share a common pathway: leveraging work-integrated learning experiences to strengthen their career readiness. Several award recipients have used internships to apply classroom knowledge to real business environments, developing data dashboards, automating processes, supporting cybersecurity initiatives, and contributing to enterprise-level digital projects.
For some, these internships have served as stepping stones to contract or full-time roles in areas such as business analysis, project management and data operations. Others have progressed to subsequent placements in high growth sectors, where exposure to real world challenges has helped refine their technical skills and broaden their understanding of industry expectations.
These experiences reflect SIM’s commitment in shaping leaders of the future and fostering Sustainable Employment through Work-Integrated Learning, demonstrating how structured internships, supported by SIM’s guidance and reinforced through the WILL Award, equip learners with practical competencies and professional confidence to navigate evolving career landscapes.
Impact on Employability
Internship experience is a proven differentiator in hiring decisions. According to global employability studies, candidates with practical exposure are significantly more likely to secure roles and advance in their careers. The SIM60 WILL Award amplifies this advantage by validating the quality of a student’s internship performance. For employers, it serves as a trusted benchmark of talent. For graduates, it opens doors to opportunities that might otherwise remain out of reach, enhancing employability in a rapidly evolving economy.
Key Takeaways
The SIM60 WILL Award reflects SIM’s ongoing efforts to integrate work experience into education, supporting students in building practical skills that complement academic learning. By recognizing internship excellence, the award highlights the importance of resilience and adaptability in preparing graduates for the evolving job market.
References:
- SIM60 WILL Award/Career Service – https://www.sim.edu.sg/degrees-diplomas/life-at-sim/career-services
- Ng Jing Heng on Turning an Internship into a Career Launchpad – https://www.sim.edu.sg/articles-inspirations/ng-jing-heng-on-turning-an-internship-into-a-career-launchpad
- Chen Soon Keat’s Journey from Intern to Innovator – https://www.sim.edu.sg/articles-inspirations/chen-soon-keat-journey-from-intern-to-innovator
Hashtag: #SIMGlobalEducation #SIMGE #GlobalEducation #InternationalDegree #CareerReady #FutureSkills
The issuer is solely responsible for the content of this announcement.
About SIM Global Education
SIM Global Education (SIM GE) is a leading private education institution in Singapore and the region. We offer more than 140 academic programmes ranging from diplomas and graduate diploma programmes to bachelor’s and master’s degree programmes with some of the world’s most reputable universities from Australia, Canada, Europe, United Kingdom, and the United States. SIM GE’s cohort is made up of 16,000 full- and part-time students and adult learners, of which approximately 36% are international students hailing from over 50 countries.
SIM GE’s holistic learning approach and culturally diverse learning environment aim to equip students with knowledge, industry skills and employability competencies, as well as a global perspective to succeed as future leaders in a fast-changing, technologically driven world.
For more information on SIM Global Education, visit sim.edu.sg
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