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Temus Becomes Singapore’s First OutSystems Premier Partner, Accelerating Low-Code Adoption Amid Surging Demand

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SINGAPORE – Media OutReach Newswire – 10 March 2025 – Temus, a Singapore-based digital transformation consultancy, has become the first OutSystems Premier Partner in Singapore. This milestone underscores Temus’ deep expertise in AI-powered low-code development and commitment to accelerating digital transformation for businesses, even more so as low-code platforms gain momentum in Singapore’s digital ecosystem.

From left: Wong Seok Ling, Managing Director, Cloud, Applications & Platform (Low-Code), Temus; Leonard Tan, Regional Director, Singapore, Malaysia, Brunei and Greater China Region, OutSystems; Ng Lai Yee, CEO, Temus; Arnold Consengco, Regional Vice President, South East Asia/Greater China Region, OutSystems; Andri Agustinus, Regional Vice President, Solution Architecture, APAC, OutSystems; Daniel Lim, Managing Director, Cloud, Applications & Platform, Temus; Wu Chun Wei, Managing Director, Cloud, Applications & Platform, Temus

This recognition cements more than a decade of collaboration between Temus and OutSystems. As OutSystems’ longest-serving services partner in Southeast Asia, it also affirms the strong track record of Temus’ low-code practice in delivering complex, enterprise-grade web and mobile applications with speed and efficiency across both public and private sectors.

Low-code development platforms such as OutSystems have seen growth in popularity and impact in recent years. These platforms enable businesses to build robust digital applications with significantly reduced coding effort, speeding time-to-market and cutting operational costs. The demand for such solutions is soaring; IDC predicts[1] that by 2025, more than 60% of enterprises globally will adopt low-code technologies, with Asia-Pacific leading much of this growth. Meanwhile, research[2] shows that the global low-code development platform market size is worth around USD 10.46 billion in 2024 and is anticipated to reach around USD 82.37 billion by 2034. In Singapore alone, digitalisation has surged under the government’s Smart Nation 2.0 initiative, catalysing fresh demand for cost-effective and rapid software deployment methods.

“We are proud to be named as OutSystems Premier Partner. It is a significant milestone that recognises our deep expertise and shared vision for accelerating digital transformation through the use of low-code,” said Daniel Lim, Managing Director, Cloud, Applications and Platform, Temus. “It also represents our strong commitment to combining the power of low-code with Temus’ broader capabilities in cloud, data, and AI. We look forward to deepening our collaboration with OutSystems to drive innovation and deliver even greater value to our customers.”

Accelerating Digital Transformation at Scale
Temus’ track record in harnessing OutSystems’ AI-powered low-code platform to deliver enterprise-grade solutions to customers in various business domains has been noteworthy:

  • In the telecommunications sector, the firm has deployed customer-facing mobile applications for a leading Singapore telco, enabling users to purchase data roaming, manage subscriptions and tap into self-service functions. The team successfully rolled out a mobile virtual network operator (MVNO) offering built on the OutSystems platform for consumers in Singapore within a short span of six months.
  • In education, Temus has built digital solutions for academic institutions, introducing streamlined apps that consolidate attendance tracking, schedule management and campus services which has created new digital experiences across their staff and students.
  • Temus has also helped public-sector agencies implement process automation and compliance management tools, improving operational efficiency. In one notable deployment, a permit and driver management system for a major airport operator reportedly cut manual documentation by half, freeing time for higher-value activities and minimising compliance errors.

Growing the Local Tech Talent Pool
Reflecting Singapore’s broader push to develop its digital technology workforce, Temus is also constantly strengthening its OutSystems practice through talent development.

Launched in 2022, the firm’s flagship career conversion programme, Step IT Up Singapore (SIU), has already placed 59 graduates in full-time technology roles, of whom, 17 individuals became low-code application developers. This move reinforces a national effort in bridging tech skills gaps, with Singapore’s Infocomm Media Development Authority (IMDA) scaling efforts[3] in pre-employment training and mid-career upskilling programmes to expand and level up Singapore’s pool of tech talent.

Building on the success of Temus’ past three SIU cohorts, the firm plans to hire, train and place more OutSystems developers in 2025. These efforts reinforce not just the firm’s commitment to deliver quality solutions to the customers, but also a dedication to contributing to the tech community in Singapore.

Capitalising on AI and Emerging Technologies
The momentum behind low-code is further bolstered by rapid advances in artificial intelligence, data analytics and cloud infrastructure—areas where Temus and OutSystems bring strong expertise. With OutSystems’ AI-driven tools AI Agent Builder and Mentor, businesses can build robust, scalable solutions more efficiently with intelligent suggestions and AI-powered insights that enhances productivity and ensures code quality.

“We congratulate Temus on becoming the first Premier Partner in Singapore. This achievement underscores our shared commitment to accelerating digital transformation and equipping businesses with the agility to thrive in an evolving landscape,” said Mark Weaser, APAC Vice President, OutSystems. “Temus has built an impressive track record in delivering impactful solutions through the years with OutSystems. With AI and other emerging technologies progressing swiftly, we see even greater opportunities to deepen our collaboration.”

With the region’s appetite for digital solutions poised to grow, Temus’ Premier Partner status and robust expertise in OutSystems technology place it at the vanguard of Singapore’s AI-powered low-code revolution.

Hashtag: #Technology #Business #Coding #LowCode #Temus #OutSystems

The issuer is solely responsible for the content of this announcement.

Temus

Temus was established by Temasek in partnership with UST, to provide digital transformation solutions for the private and public sectors as we aspire to be a strategic partner in realising the Singapore Government’s Smart Nation vision. We are headquartered in Singapore and have more than 400 employees across a wide range of disciplines in strategy, design, architecture, technology, data & AI.

For more information, please visit

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HYTE’S X50 and X50 Air Modern Performance Cases Now Available

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Available in Six Expressive Colorways, HYTE’s Latest PC Case Delivers Perfect Balance of Form and Function with Accessible Pricing

CALIFORNIA, UNITED STATES – Media OutReach Newswire – 19 December 2025 – HYTE, a leading manufacturer of cutting-edge PC components and peripherals, announces its highly anticipated X50 and X50 Air Modern Performance Cases are now available. Following its successful Computex 2025 debut, the X50 cases are meticulously designed chassis engineered with premium materials and finishes for incredible durability, while maintaining a builder-friendly experience with tool-less panels, integrated cable management, and future-proof component compatibility.

HYTE’S X50 AND X50 AIR MODERN PERFORMANCE CASES

HYTE’s new X50 and X50 Air cases redefine traditional PC chassis design with fully rounded construction and built-in performance optimizations. These include a Full-Coverage Micro-Mesh front panel for low-pressure air intake, HYTE’s patent-pending Louvered Blade Ventilation on the back which reduces exhaust impedance while reinforcing rigidity, and a structural top-mounted PSU canopy enabling hassle-free cable management. Both cases feature massive 360mm radiator support on front and side, with total capacity for up-to-10 fans, including up to 3x 120mm extra-thick fans on the bottom for cold-floor GPU cooling.

Key features include:

  • Premium Build Materials – 1mm-thick steel improves chassis strength and durability. Manufactured with Automotive-Grade Tooling, the X50 has 4x tighter tolerances than other PC cases, achieving its signature rounded curves
  • Superior Build Experiences – The rounded design contributes to a comfortable build experience. Its tool-less front and side panels, covertly routed cable-routing channels, and spacious interiors lets anyone build in the X50 with no obstructions.
  • Distinct Aesthetic Options – X50 features sweeping curved 4mm-thick laminated acoustic glass for maximum visibility and noise dampening. X50 Air uses curved Full-Coverage Micro-Mesh panel for enhanced airflow. X50 Air available in Snow White and Pitch Black; standard X50 in Snow White, Pitch Black, Wild Cherry, Taro Milk, Strawberry Milk, and Matcha Milk

WEBSITE: https://hyte.com/store/x50

Hashtag: #HYTE

The issuer is solely responsible for the content of this announcement.

ABOUT HYTE

HYTE is a lifestyle-centered brand enhancing play with innovative PC components and accessories. Designed for gaming, music, arts and entertainment, all HYTE products are rigorously researched and tested. Visit:

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HYTE’S Soft & Curvy X50 and X50 Air Modern Performance Cases Now Readily Available

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Available in Six Expressive Colorways, HYTE’s Latest PC Case Delivers a Perfect Balance of Form and Function Through its Disciplined Multi-Dimensional Design Complete with Accessible Pricing

CALIFORNIA, UNITED STATES – Media OutReach Newswire – 19 December 2025 – HYTE, a leading manufacturer of cutting-edge PC components and peripherals, is excited to announce that its highly anticipated X50 and X50 Air Modern Performance Cases are now available. Following its successful Computex 2025 debut, the X50 cases are meticulously designed PC chassis that are engineered with premium materials and finishes that allow for incredible durability, while maintaining a builder-friendly experience with its tool-less panels, integrated cable management solutions, and future-proof component compatibility.

HYTE’S X50 AND X50 AIR MODERN PERFORMANCE CASES

HYTE’s new X50 and X50 Air cases redefine traditional PC chassis design, as both cases feature a fully rounded design with several built-in performance optimizations. These include a Full-Coverage Micro-Mesh front panel for low-pressure and low-resistance air intake, HYTE’s patent-pending Louvered Blade Ventilation on the back of the case which reduces exhaust impedance while reinforcing case rigidity, and a structural top-mounted PSU canopy that lets the PSU act as an exhaust fan while opening up hassle-free cable management. Both the X50 and X50 Air feature massive 360mm radiator support on the front and side of the case, with a total capacity of up-to-10 fans, including up to 3x 120mm extra-thick fans on the case’s bottom for cold-floor cooling that keeps any GPU comfortably cool.

Other key features of the X50 and X50 Air Modern Performance Cases include:

  • Premium Build Materials Both cases use 1mm-thick steel that improves chassis strength and durability. Manufactured with Automotive-Grade Tooling, the X50 has 4x tighter tolerances than other PC cases, which allows HYTE to achieve the X50’s rounded compounded curves
  • Superior Build Experiences – The X50 and X50 Air’s rounded design contributes to the ease of any build without being harsh on a builder’s hands. Its tool-less front and side panels, covertly routed cable-routing channels, and spacious interiors lets anyone build in the X50 with no obstructions.
  • Distinct Aesthetic Options – The X50 comes with a sweeping curved 4mm-thick laminated acoustic glass for maximum visibility and passive noise dampening. The X50 Air swaps the glass panel with a curved Full-Coverage Micro-Mesh panel that enhances the case’s airflow capabilities. While the X50 Air only comes in Snow White and Pitch Black, the standard X50 will be available in Snow White, Pitch Black, Wild Cherry, Taro Milk, Strawberry Milk, and Matcha Milk colorways.

WEBSITE:
To know more about an X50 or an X50 Air Modern Performance Case, please visit: https://hyte.com/store/x50
Hashtag: #HYTE

The issuer is solely responsible for the content of this announcement.

ABOUT HYTE

HYTE is a lifestyle-centered brand focused on enhancing play with its fresh and innovative PC components and accessories. Designed to fuel passions in gaming, music, the arts and entertainment, all HYTE products are rigorously researched and tested before they are brought to fruition. HYTE, as a company and its products, are inspired by the needs and behaviors of its community and the many ways people play. HYTE is committed to designing products to help people experience play throughout their lifestyle, no matter what that may be. To learn more, please visit:

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SIM60 WILL Award: Elevating Employability Through Work-Integrated Learning

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SINGAPORE – Media OutReach Newswire – 19 December 2025 – In today’s competitive job market, academic excellence alone is no longer sufficient for career success. Employers increasingly value graduates who demonstrate resilience, adaptability, and real-world experience. To address this shift, SIM has introduced the SIM60 Work-Integrated Learning (WILL) Award, a prestigious accolade that celebrates students who excel in internships and embody qualities essential for thriving in the workplace.

Work-Integrated Learning Matters

Work-Integrated Learning bridges the gap between classroom theory and practical application. By immersing students in authentic work environments, internships cultivate essential skills beyond technical knowledge, including cognitive abilities such as problem-solving, affective traits like emotional intelligence, and psychomotor skills that enhance hands-on performance. Graduates who master these dimensions stand out as versatile professionals ready to contribute from day one, shaping leaders of the future who can drive innovation and growth.

The SIM60 WILL Award: Setting Graduates Apart

The SIM60 WILL Award is more than a recognition, it is a testament to resilience and excellence. Students who complete internships successfully and demonstrate perseverance in challenging situations are honoured for their commitment to growth. This award signals to employers that recipients are not only academically competent but also workplace-ready, equipped with the adaptability and grit that modern industries demand. It reinforces SIM’s mission to foster sustainable employment by preparing graduates for long-term career success.

Success Stories That Inspire

Recipients of the SIM60 WILL Award come from varied academic and personal backgrounds, yet many share a common pathway: leveraging work-integrated learning experiences to strengthen their career readiness. Several award recipients have used internships to apply classroom knowledge to real business environments, developing data dashboards, automating processes, supporting cybersecurity initiatives, and contributing to enterprise-level digital projects.

For some, these internships have served as stepping stones to contract or full-time roles in areas such as business analysis, project management and data operations. Others have progressed to subsequent placements in high growth sectors, where exposure to real world challenges has helped refine their technical skills and broaden their understanding of industry expectations.

These experiences reflect SIM’s commitment in shaping leaders of the future and fostering Sustainable Employment through Work-Integrated Learning, demonstrating how structured internships, supported by SIM’s guidance and reinforced through the WILL Award, equip learners with practical competencies and professional confidence to navigate evolving career landscapes.

Impact on Employability

Internship experience is a proven differentiator in hiring decisions. According to global employability studies, candidates with practical exposure are significantly more likely to secure roles and advance in their careers. The SIM60 WILL Award amplifies this advantage by validating the quality of a student’s internship performance. For employers, it serves as a trusted benchmark of talent. For graduates, it opens doors to opportunities that might otherwise remain out of reach, enhancing employability in a rapidly evolving economy.

Key Takeaways

The SIM60 WILL Award reflects SIM’s ongoing efforts to integrate work experience into education, supporting students in building practical skills that complement academic learning. By recognizing internship excellence, the award highlights the importance of resilience and adaptability in preparing graduates for the evolving job market.

References:

  1. SIM60 WILL Award/Career Service – https://www.sim.edu.sg/degrees-diplomas/life-at-sim/career-services
  2. Ng Jing Heng on Turning an Internship into a Career Launchpad – https://www.sim.edu.sg/articles-inspirations/ng-jing-heng-on-turning-an-internship-into-a-career-launchpad
  3. Chen Soon Keat’s Journey from Intern to Innovator – https://www.sim.edu.sg/articles-inspirations/chen-soon-keat-journey-from-intern-to-innovator

Hashtag: #SIMGlobalEducation #SIMGE #GlobalEducation #InternationalDegree #CareerReady #FutureSkills

The issuer is solely responsible for the content of this announcement.

About SIM Global Education

SIM Global Education (SIM GE) is a leading private education institution in Singapore and the region. We offer more than 140 academic programmes ranging from diplomas and graduate diploma programmes to bachelor’s and master’s degree programmes with some of the world’s most reputable universities from Australia, Canada, Europe, United Kingdom, and the United States. SIM GE’s cohort is made up of 16,000 full- and part-time students and adult learners, of which approximately 36% are international students hailing from over 50 countries.

SIM GE’s holistic learning approach and culturally diverse learning environment aim to equip students with knowledge, industry skills and employability competencies, as well as a global perspective to succeed as future leaders in a fast-changing, technologically driven world.

For more information on SIM Global Education, visit

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