Sat. Nov 23rd, 2024

Honeywell Changes Product Packaging, Logo

honeywell flour mills

By Modupe Gbadeyanka

The management of Honeywell Flour Mills Plc has announced changes to its corporate logo and product packaging.

A statement signed by the firm’s Secretary, Mrs Oluwayemisi Busari, on Tuesday, August 8, 2017, explained that, “These changes were premised on the need to re-position the Honeywell brand in order to achieve greater alignment with its vision and strategic objectives, and will entail unifying all the Honeywell brands under a single, contemporary Masterlogo and also redesigning and modernizing product package across the B2B and B2C ranges.”

Honeywell Flour Mills Plc is a major flour milling company in Nigeria and was initially registered as Gateway Honeywell Flour Mills Limited in 1985. However, in June 1995, a change in the company’s ownership structure led to a change of name to Honeywell Flour Mills Limited (HFML).

The entry of the company into the flour milling industry in Nigeria redefined industry standards as its high quality compelled an improvement in the quality of flour products by other players. Over the years HFMP has positioned itself as a market leader in milling, processing & packaging of flour and other wheat based products.

After its initial public offering (IPO) in 2008, the company became a public liability company and was listed on the Nigerian Stock Exchange (NSE) in 2009.

Honeywell Flour Mills Plc produces and markets seven major product brands which include Honeywell Superfine Flour, Honeywell Wheat Meal, Honeywell Semolina, Honeywell Noodles, Honeywell Pasta, Honeywell Composite flour, and Honeywell Brown Flour.

By Modupe Gbadeyanka

Modupe Gbadeyanka is a fast-rising journalist with Business Post Nigeria. Her passion for journalism is amazing. She is willing to learn more with a view to becoming one of the best pen-pushers in Nigeria. Her role models are the duo of CNN's Richard Quest and Christiane Amanpour.

Related Post

Leave a Reply

Your email address will not be published. Required fields are marked *