Media OutReach
A Well-Oiled Machinery & Equipment Sector: The Silent Strength Powering Malaysia’s Semiconductor Manufacturing Excellence
This is not the story of flashy innovation or overnight success. It’s the story of four decades spent mastering the unglamorous but indispensable, precision robots that place components with microscopic accuracy, testing equipment that validates every nanometer, and clean room systems that maintain environments more sterile than operating theatres. Behind every chip that rolls off a Malaysian assembly line lies this web of engineering excellence, a competitive advantage so deeply embedded that even global giants struggle to replicate it.
Malaysia ranks as the sixth largest semiconductor exporter globally and commands 13 per cent of the world’s Assembly, Testing and Packaging Operations.
As Datuk Sikh Shamsul Ibrahim Sikh Abdul Majid, CEO of the Malaysian Investment Development Authority (MIDA), puts it, “When global semiconductor companies look at Malaysia, they see our competitive costs or our location, But, what really differentiates us is our comprehensive Machinery and Equipment (M&E ecosystem) — the ability to not just build but continuously innovate and maintain the incredibly sophisticated equipment that semiconductor operation depends on.
The integrated Machinery and Equipment (M&E) ecosystem has been fundamentally shaped by key Foreign Investments (FI) that serve as catalysts for local capacity building. Global leaders specialising in front-end equipment, such as LAM Research and Applied Materials, have established major manufacturing and support operations in Malaysia, creating extensive sourcing opportunities for local players. At the same time, back-end equipment innovator Besi APAC and Cohu actively collaborates with Malaysian companies, transferring expertise in high-precision manufacturing. This strategic integration has played a critical role in advancing homegrown champions such as Pentamaster, Vitrox, Greatech, Tonasco and SFP, enabling them to evolve from simple component suppliers into engineering partners capable of meeting global standards in advanced packaging and complex assembly.
This robust ecosystem, honed across generations of manufacturing excellence, is Malaysia’s quiet competitive edge. It comprises a complete value chain, supported by our foundational engineering support expertise in precision machining, tooling, and high-tolerance metal fabrication, which forms the physical backbone for more complex automated equipment and robotics. And now, as the country pivots from its decades-long dominance in downstream activities toward capturing high-value front-end segments, that machinery and equipment foundation is about to become its most potent weapon.
MIDA’s Gameplan: A Multi-Pronged Strategic Push
The shift is as ambitious as it is necessary. High-value segments such as chip design and advanced manufacturing technologies depend on specialised M&E such as lithography, deposition, and etching equipment — critical processes that define the performance and capabilities of every modern chip.
MIDA is spearheading the shift by positioning Malaysia as a regional hub for front-end semiconductor M&E manufacturing, guided by clear mandates from the New Industrial Master Plan (NIMP) 2030 and the National Semiconductor Strategy (NSS). On the international front, the agency is actively courting global pioneers in front-end equipment manufacturing to attract anchor investments that will accelerate the development of a sophisticated, high-value manufacturing ecosystem within Malaysia.
The strategic push, however, goes beyond just attracting investments. MIDA is building a thriving high-tech ecosystem to support technology transfer, knowledge exchange and collaborative innovation. The agency maps local manufacturers and facilitate high-impact business matching at key events like SEMICON Southeast Asia 2025, creating direct pathways for Malaysian suppliers to embed themselves into global supply chains and engage with industry titans like ASML, Ferrotec, and Micron.
The goal is nothing less than repositioning Malaysian M&E companies from component suppliers to strategic innovation partners in the most critical segments of the global value chain.
Nurturing Homegrown Champions
Yet for all the emphasis on global partnerships, MIDA understand that Malaysia’s semiconductor future must be built on homegrown capabilities. The focus has shifted toward nurturing deep expertise in highly specialised areas such as, advanced mechatronics, precision optics, and complex process technologies. Through targeted facilitation and incentives. the government is betting that Malaysian companies can close the gap with global leaders faster than anyone expects.
Industry veterans like Chuah Choon Bin, founder and executive chairman of Penang-based Pentamaster Corporation Berhad, welcome the support. “In today’s fiercely competitive environment, where intense price competition particularly from China continues to put pressure on margins, the financial support from the government is crucial to help Malaysian companies like us to remain competitive globally,” he explains.
For Pentamaster, which has been operating since 1991, the fiscal support provided by the Malaysian Government through MIDA have been transformative. “These facilitation allow us to intensify R&D, adopt cutting-edge technologies and expand into advanced technology areas in the ATE and FAS segments.” Chuah notes. “They provide the necessary support for us to invest in next-generation technologies like advanced packaging technologies and shorten our time-to-market, which is critical in an industry driven by rapid innovation cycles,”.
Pentamaster’s story reflects the broader heritage that makes Malaysia’s M&E sector resilient. Back then, Penang hosted a deep ecosystem in M&E, electronics, sheet metal fabrication and semiconductor manufacturing.
That heritage, Chuah said, “provided Pentamaster with access to a skilled workforce, precision engineering know-how and a strong supplier network”, advantages that continue to pay dividends today.
The Turning Point
This evolving narrative marks a crucial turning point for Malaysia: the country is ascending from an auxiliary support role to a core position in the advanced chip production infrastructure. The country that spent decades perfecting the machinery behind the scenes is stepping into the spotlight, ready to claim its place among the semiconductor elite.
For a nation that has always let its work speak louder than its words, this moment feels both inevitable and earned. Malaysia’s enduring semiconductor legacy, built on precision, persistence, and the unglamorous art of making things work, is about to be cemented on the global map.
And, the machinery that got them here is just getting started.
Hashtag: #MIDA
The issuer is solely responsible for the content of this announcement.
Actively Promote the “Bringing in and Going Global” Strategy to Empower I&T Companies to Expand into the GBA and Overseas Markets
- HKSTP leads 13 park companies to CHTF 2025, “China’s No. 1 Technology Exhibition”, presenting breakthroughs across AI, robotics, new energy, semiconductors, smart manufacturing, biotech, fintech, and more
- The Hong Kong Pavilion features end-to-end innovation from R&D to application, with live demos and business matching for global buyers.
- HKSTP’s Shenzhen Branch advances the “Bringing In, Going Global” strategy with a one-stop platform, helping tech companies scale in the GBA and globally.
HONG KONG SAR – Media OutReach Newswire – 15 November 2025 – Hong Kong Science and Technology Parks Corporation (HKSTP) has brought 13 park companies and startups to the 27th China Hi-Tech Fair (CHTF), taking place from 14 to 16 November at the Shenzhen World Exhibition & Convention Center (Bao’an). Within the Hong Kong Pavilion, HKSTP has set up a dedicated showcase to highlight the latest research and real-world applications across artificial intelligence (AI), robotics, new energy, semiconductors, smart manufacturing, biomedical technology, and fintech. HKSTP partners with park companies to participate in this grand event, promoting Hong Kong’s innovation and technology (I&T) on the global stage, acting as a “super-connector” to drive business matching and financing opportunities, strengthen Hong Kong’s position as an international I&T hub, and further advancing I&T development in Hong Kong and the Greater Bay Area (GBA).
Recognised as “China’s No.1 Technology Exhibition,” CHTF is the nation’s largest and most influential technology fair, convening industry leaders, fast-growing enterprises, research institutions, and global partners. This year’s fair spans AI, robotics, new energy, semiconductors, smart manufacturing, biotech and fintech, drawing strong participation from government, industry, investors, and media. HKSTP is presenting full-spectrum innovation – from lab research to commercialisation – to global buyers, supporting partners to expand internationally and advancing Hong Kong’s transformation into an international I&T centre. HKSTP orchestrated a series of high-profile product debuts and presentations at the fair to showcase cutting-edge technologies, spotlighting the innovative capabilities of park companies and startups, fostering international collaboration.
Pheona Kan, Director of New Ventures of HKSTP said, “HKSTP has consistently provided a platform for I&T enterprises to showcase their capabilities while connecting partners and investors to accelerate commercialisation and market opportunities. The presence of more than 10 park companies at CHTF marks another milestone in our mission to drive innovation, accelerate results commercialisation. As the ‘barometer of China’s tech,’ CHTF provides an ideal platform to showcase the journey from research to market to a global audience, deepen Hong Kong-Shenzhen collaboration, further energising Hong Kong and the GBA’s I&T ecosystem. Furthermore, HKSTP actively leads I&T companies in going global, assisting them in expanding their businesses overseas, while enabling overseas technology companies to understand Hong Kong’s business advantages, leveraging Hong Kong as an international springboard to tap into the Asian market.”
The HKSTP actively leads park companies to participate in various influential innovation and technology events. This year, for the first time, HKSTP leads companies from both the Hong Kong and Shenzhen branches to make a joint appearance at the Hong Kong Pavilion of the CHTF. The Hong Kong Science Park Shenzhen Branch, built on the solid foundation of the Hong Kong Science Park, extends facilities and the innovation and technology ecosystem into the Greater Bay Area, establishing a new hub as a regional development bridge for innovative companies. Officially opened in September 2023 and located just 1,200 meters from Futian Port, the HKSTP Shenzhen Branch in Futian spans 31,000 square meters across two buildings equipped with dry and wet laboratories, co-working spaces, and meeting and exhibition facilities. The Shenzhen Branch continues to grow its innovation community, helping companies seize the vast opportunities of the GBA market by leveraging HKSTP’s one-stop platform and “super-connector” capabilities to drive the “Bringing In, Going Global” strategy and contribute to the GBA’s development as an international innovation hub.
A Showcase of Groundbreaking I&T Achievements
13 HKSTP park companies are demonstrating innovative technology solutions. Highlights include:
- Ori-sys Technology Limited: Leveraging world-leading MEMS technology, the company has developed the world’s first miniature visual-tactile sensor for robotics. This technology overcomes key barriers in dexterous robotics hand applications and shows strong potential in smart gloves, dexterous manipulators and electronic skin. Ori-sys recently won the Bronze Award at the Guangdong-Hong Kong-Macau Greater Bay Area Entrepreneurship Competition.
- MEINONG ROBOT CO., LIMITED: Focused on agricultural robotics for fruit and vegetable harvesting – currently in grapes, oranges, and mangoes – its solutions improve harvesting efficiency, reduce labour costs, and minimise fruit damage. MEINONG was awarded the Third Prize at the 17th China Shenzhen Innovation and Entrepreneurship Competition (Xinjiang Production and Construction Corps (XPCC) Division, and the 2nd Xinjiang Shenzhen Offshore Innovation Competition (Southern Xinjiang Finals).
- Haptron Scientific (Shenzhen) Limited: Specializing in optical force-sensing, the Photon series of multi-dimensional force sensors enables precise force control across collaborative robots, precision matching, aerospace, medical devices, and new energy vehicles, offering one-stop force sensing solutions for multiple industries
- Rafael Biotechnology (Shenzhen) Co., Ltd.: Using quantum plasmonic lab-on-chip (QPLoC) technology, the company has developed a label-free biosensing platform capable of multiplex detection within 15 minutes for biomedical research, drug discovery, and in-vitro diagnostics (IVD).
The 27th China High-Tech Fair (CHTF)
Date: 14-16 November 2025 (Friday – Sunday)
Venue: Shenzhen World Exhibition & Convention Center (Bao’an)
HKSTP Booth Number: Hall 13, Booth B31
Appendix 1: List of the 13 Park companies that are exhibiting at the China High-Tech Fair:
- Akso Health Technology Limited
- e-SENSOR TECHNOLOGY LIMITED
- FluviusH2 Limited
- Geosys Hong Kong Limited
- Haptron Scientific (Shenzhen) Co., Ltd
- Hong Kong JR Group Limited
- LinkPOWER Technology Company Limited
- MEINONG ROBOT CO., LIMITED
- Ori-sys Technology Limited
- Rafael Biotechnology (Shenzhen) Company Limited
- Shenzhen Xingyuan Zhilian Technology Co.,Ltd
- SP Infinite Technology
- Vista Innotech Limited
Hashtag: #HKSTP
The issuer is solely responsible for the content of this announcement.
About Hong Kong Science and Technology Parks Corporation
Hong Kong Science and Technology Parks Corporation (HKSTP), was established in 2001, to create a thriving innovation and technology (I&T) ecosystem grooming 13 unicorns, nurturing over 15,000 research professionals, and over 2,400 technology companies from 26 countries and regions focused on developing healthtech, AI and robotics, fintech and smart city technologies, etc.
Our growing innovation ecosystem offers comprehensive support to attract and nurture talent, accelerate and commercialise innovation for technology ventures, with the I&T journey built around our key locations of Hong Kong Science Park in Pak Shek Kok, InnoCentre in Kowloon Tong and three modern InnoParks in Tai Po, Tseung Kwan O and Yuen Long realising a vision of new industrialisation for Hong Kong, where sectors including advanced manufacturing, micro-electronics and biotechnology are being reimagined..
Hong Kong Science Park Shenzhen Branch in Futian, Shenzhen plays positive roles in connecting the world and the mainland with our proximity, strengthening cross-border exchange to bring advantages in attracting global talent and allowing possibilities for the development of technology companies in seven key areas: Medtech, big data and AI, robotics, new materials, microelectronics, fintech and sustainability, with both dry and wet laboratories, co-working space, conference and exhibition facilities, and more.
Through our R&D infrastructure, startup support and enterprise services, commercialisation and investment expertise, partnership networks and talent traction, HKSTP continues to contribute in establishing I&T as a pillar of growth for Hong Kong.
More information about HKSTP is available at 
www.hkstp.org.
Media OutReach
Gree Provides Comprehensive Support for COP30 Leaders’ Residence, Empowering Global Climate Action with Green Technology
As a central hospitality facility during COP30, Vila Líderes comprises 405 suites and multiple functional spaces, including lobbies, office areas, conference rooms, fitness centers, restaurants, and café-bars, with a total floor area of 19,000 square meters. In close collaboration with local strategic partner Grupo Imperador, Gree has customized a Variable Refrigerant Flow (VRF) multi-split system for the project, deploying 443 indoor units and 36 outdoor units with a total cooling capacity of 718 horsepower.
The system utilizes Gree’s GMV Slim and GMV X series products, leveraging variable refrigerant flow technology to achieve precise temperature control and efficient operation. Compared to previous-generation systems, it improves energy efficiency by approximately 10% under partial load conditions. The intelligent control unit automatically adjusts operation based on zonal requirements, maintaining a low-noise comfort environment while significantly reducing energy consumption peaks and supporting grid stability.
Gree entered the Brazilian market in 2001 and established a production base in Manaus, becoming a significant benchmark in China-Brazil manufacturing cooperation. The Brazilian facility now spans approximately 100,000 square meters, employs over 1,600 local staff, and continuously delivers high-quality products and services to the South American market. In 2016, Gree secured the contract for the Rio Olympics, becoming the home appliance industry’s sole official Chinese supplier. Currently, Gree’s sales network covers all 27 Brazilian states and the federal district, with over 200 distributors and 1,600 after-sales service outlets across Brazil. In 2024, Gree ranked first in market share for residential air conditioning units in Brazil.
In Pará state, Gree has successively won and completed key projects including Brazil’s second-largest hydroelectric plant, the Belo Monte Phase II project, and the Pará State University solar-powered central air conditioning project. Through close collaboration with Imperador, the largest local air conditioning distributor, Gree maintains a leading market position in the region.
Vila Líderes is not only a crucial hospitality venue during COP30 but will also become a landmark sustainable development project in Belém. Gree’s high-efficiency, energy-saving air conditioning systems ensure comfort during the conference while aligning closely with global climate governance goals. This partnership fully demonstrates Gree’s technical prowess in low-carbon building and further solidifies its role as a reliable partner in the global green transition.
Gree remains committed to the green development philosophy of “Making the Sky Bluer, the Earth Greener,” continuously innovating in energy-saving and environmental protection technologies to create better living environments for global consumers.
Hashtag: #Gree
The issuer is solely responsible for the content of this announcement.
Building on a 70-year legacy, YTL Cement’s ‘Beyond 70’ Initiative Invests in a Sustainable Future for the City and the Community.
KUALA LUMPUR, MALAYSIA – Media OutReach Newswire – 14 November 2025 – YTL Cement Group has pledged to donate 70,000 trees to Dewan Bandaraya Kuala Lumpur (DBKL) for planting across Kuala Lumpur city. The initiative reinforces YTL Cement Group’s commitment to creating cleaner, more liveable and sustainable cities, a reflection of its aspiration of Helping Nations Build Greener.
This initiative was officially announced during the KL Park Festival 2025 held recently at Taman Tasik Titiwangsa, where YTL Cement was also appointed a Strategic Partner of Local Agenda 21 Kuala Lumpur (LA21KL). The event was graced by YBhg. Dato’ Seri TPr. Dr Maimunah Mohd Sharif, then Mayor of Kuala Lumpur alongside senior representatives from YTL Cement Group.
Through this partnership, YTL Cement will contribute to DBKL’s sustainability efforts in two key ways. The first is the donation of 70,000 trees, supporting the city’s climate action and biodiversity goals. The second is through the Bintang Cemerlang programme, a collaboration between YTL Cement, DBKL and UCSI University, which provides enrichment opportunities for students from 22 schools in Sentul. The programme includes academic coaching, teacher training and creative learning initiatives designed to nurture long-term potential among underserved children.
Local Agenda 21 Kuala Lumpur (LA21KL) embodies collaboration between local government, the private sector and the community to co-design and co-manage Kuala Lumpur’s urban environment. YTL Cement’s appointment as a Strategic Partner underscores its alignment with the United Nations Sustainable Development Goals (UNSDGs) particularly Goal 11: Sustainable Cities and Communities, Goal 13: Climate Action, Goal 15: Life on Land, and Goal 17: Partnerships for the Goals.
The initiative also reflects the 4P model: Public, Private, People, Partnership, championed under LA21KL, where collaboration and community participation drive lasting positive change.
Both the tree donation and the Bintang Cemerlang programme are part of BUILDS, YTL Cement Group’s Corporate Social Responsibility (CSR) arm. Together, they demonstrate the Group’s ongoing commitment to nation building, developing Malaysia’s infrastructure while uplifting communities and advancing environmental stewardship for generations to come.
Hashtag: #YTLCement
The issuer is solely responsible for the content of this announcement.
About YTL Cement Group
YTL Cement is Malaysia’s pioneer and largest building materials group. With a network of cement plants, terminals, ready mixed concrete batching facilities, drymix operations and aggregate quarries, YTL Cement is recognised as a partner in nation building. Over its 70 year legacy, the Group has contributed to iconic developments including the Petronas Twin Towers, Merdeka 118, SMART Tunnel and the nation’s airports and bridges.
The Group has expanded its footprint regionally and recently introduced the ECO Product Range, offering low carbon alternatives including ECOCem low carbon cement, ECOConcrete, ECOSand and ECODrymix to support the construction industry’s transition toward more sustainable solutions.
About BUILDS
BUILDS is a Corporate Social Responsibility commitment from YTL Cement Group to build together with and for the communities we live and work in. BUILDS is dedicated to supporting causes which extend beyond business objectives. Its goals are centred around ensuring and contributing to the wellbeing of people, the environment, and the making of sustainable and worthwhile progress.
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